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Plasma Systems

 

Originating from the former TePla AG Munich, the division Plasma Systems designs, develops and builds customer specific plasma equipment. The division specializes in technologies used for the surface modification of substrates through the controlled application of plasma..


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Photoresist Ashing


Photoresist Ashing




The removal of photoresist masks after processes such as etching and implantation, is one of the most important and frequently performed steps in front-end semiconductor manufacturing.
   




PS 300 Series
GIGAbatch 310 M


The PS 300 series of microwave batch resist ashers ranges from manual to fully automated accommodating wafers from 2" to 8" (50 to 200 mm) ...  mehrmore
   

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PS 4008
GIGAbatch 360M / 380M


Compact system in floor standing cabinet, manual drawer door. Designed for volume production at low COO, targeting fabrication of MEMS and HB-LEDs ...  mehrmore
   

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PS 600
GIGAbatch 360P / 380P



High-volume asher for advanced waferfabs, motorized door, ready for combination with a wafer transfer unit for sage and gentle automatic wafer loading. Of up to 50 wafers simultaneously, resulting in a ...  mehrmore
   

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ps 210
PS 210


The Microwave Plasma System 210 is our most popular full featured plasma surface modification system designed for laboratory and production use ... mehr more
   

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GIGAfab M


Most compact version of the GIGAfab model family, targeting SU-8 Removal, MEMS Fabrication, Wafer Bumping and Flat Panel Display Technology ...  mehrmore
   

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PS 4008
GIGAfab A200/300


Automatic Single Wafer Asher for 200 or 300 mm Wafers, serving Semiconductor Device Fabrication, Wafer Bumping and MEMS Manufacturing ...  mehrmore
   



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Flat Panel Display


Flat Panel Display
To assure the best pixel formation and maximum luminosity, the Ink Jet Printing of PLED Displays requires a very specific surface condition.
   



PS 4011
PS 4011


The plasma system 4011 is designed for process development of flat panel displays. The chamber is loaded manually. The glass plates are easily placed ... mehrmore
   



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Chip Packaging


Chip Packaging



In chip packaging, plasma cleaning is essential for improving the cleanliness of bond pads prior to wirebonding. Ball shear and stitch pull strengths are dramatically enhanced by surface plasma cleaning.
   



GIGA 690
GIGA 690



The Plasma System GIGA 690 is a state-of-the-art plasma processing equipment. It is a PC-controlled ...  mehr more
   

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PS 400/660
PS 400/660



The Microwave Plasma Systems 400/660 are the most versatile plasma cleaners in the world of chip packaging ...  mehr more
   

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PS 400/660 IL
PS 400 Inline



The Microwave Plasma Systems 400 Inline are the most versatile plasma cleaners in the world of chip packaging ...  mehrmore
   

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PS 400 H2
PS 400 H2



The Microwave Plasma Systems 400/660 Inline are the most versatile plasma cleaners in the world of chip packaging ...  mehrmehr
   

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PS 80 Plus
GIGA 80 Plus


The Plasma System GIGA 80 PLUS is the only fully automatic low-pressure Microwave Plasma System worldwide focused on the cleaning of individual substrates to improve die attaching, wire bonding ...mehrmore
   





GIGA 690
GIGA Fab Asyntis M



GIGAfab ASYNTIS is a plasma etching system equipped with chamber downstream configuration and ...  mehr more
   


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Wafer thinning

Waferdünnen




For Stacking Dies, the final chip thickness is reduced to 30 µm and below. In production, however, these thicknesses cannot be achieved by grinding, especially since stress relief in high volume production becomes an important issue at 50 µm and below.
  



PS 80 Plus Asyntis
PS 80 Plus Asyntis


Chip Side Healing Back-Side Stress Relief (AES Process, active side faces dicing tape) Contact free exposing 3D-TSV (AES Process, active side faces dicing tape)
Wafer and Die Thinning (AES Process,  ...  mehrmore
  

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PS 4008 Asyntis / OEM
PS 4008 Asyntis / OEM


The PS 4008 ASYNTIS/OEM is a remote cold plasma system based on microwave plasma generation. The manual machine is ideally suited for many different applications such as stress relief, special surface treatments and wafer thinning.
In this plasma system ...  mehrmore
  

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Asyntis 2.2
Asyntis 2.2




Fully Automated Remote Plasma System .  mehrmore
  



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Solar Cell Etching

Solarzellenätzen

Poly-silicon plasma etching for solar cell production has earned the reputation of being fast, reliable and above all economical.
   


PS 400 Solar
Microwave Plasma System GIGA 690 Solar



Batch system for solar cell surface and edge treatment of wafer sizes up to 210 x 210 mm...  mehrmore

   
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RF Plasma

RF Anlagen Material surfaces that require cleaning, coating or chemical modification are immersed into the energetic environment of an RF plasma. Here they are subjected to chemically reactive species that are carried to their surfaces by the directional effects of the RF plasma.

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