Measurement

For the quality check of materials PVA TePla offers a variety of optical and ultrasonic inspection systems.

Measurement

	SIRD The introduction of the 300mm wafers has required further fab refinements, bringing also new standards for the suppliers of such of bare wafers: Increasing from 200 mm to 300mm diameter, the wafer has more than doubled it's surface  ...  more

	TWIN The Implant process is a very critical step within the integrated circuits manufacturing line. It defines important characteristics and properties of the devices-to-be by doping certain layers of the silicon substrate. Rework processes  ...  more

Ultrasonic Measurement

PVA TePla also offers Ultrasonic Measurement for the nondestructive Inspection of High tech materials. Find more to this on the Homepage of our subsidiary PVA TePla Analytical Systems:

     www.pva-analyticalsystems.com

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