Semiconductors

The highly innovative chip industry requires new materials and technologies for:

 

• higher processing power
• faster connections
• higher memory capacity

PVA TePla offers a wide range of highly innovative key technologies for the semiconductor market, especially in the segments crystal growing, surface engineering and analytical systems.

Vacuum Furnaces

 

	COV Heat Treatment Furnaces with Graphite Resistance Heater COV heat treatment furnaces are high performance most efficient furnaces with a wide working-temperature and application range. Due to the compatibility with all kind of process gases and the fully automatic process ...  more

Crystal Growing Systems

 

	Typ EKZ 3500 The EKZ 3500/200 is used to produce crystals up to 200mm in diameter. The typical batch weights range between 120 and 150kg, depending on the hot zone installed and the use of feeder for increasing the batch weight. The crystal lengths obtainable from such batch sizes measure about 1.5m in the cylindrical portion ...   more

 

	Typ EKZ 3000 Compared to the crystal pulling equipment used until now, the concept and design of the 300mm plant signify a quantum leap. In developing the plant, consideration was given to all knowledge gained to date and to the available know-how of our customers worldwide. These furnaces provide ideal conditions for meeting crystal quality requirements. ...   more

 

	Typ FZ 14 This machine is an intelligently designed piece of equipment, which in addition to meet the requirements in silicon crystal growing at diameters up to 4 inch and at the same time with reasonable physical dimensions. The machine have a crystal growing length of 1300 mm and produces 3" crystals up to ...     more

	Typ FZ 14 M For analytical purposes, the FZ-14M has been developed. This a is a floatzone Silicon crystal grower specifically designed in accordance with the requirements of ASTM Std. F1723-96. The FZ-14M converts minature rods of polycrystalline silicon into monocrystalline silicon for use in the assessment of the ...   more

 

	Typ FZ 30 The FZ-30 consists of a main, upper and lower chamber and an upper and lower pulling arrangement, all built as modules. The FZ-30 is fully equipped with access doors, a tank circuit, a control panel, a high frequency generator, a data logging system and an operator’s platform ...    more

 

	Typ Delta This low-pressure/low-temperature equipment is designed for chemical vapor deposition (CVD) of SiGe or SiGe:C onto silicon wafers of 200 and 300mm diameter. The modular system with vertically arranged reactor is intended for cassette-to-cassette operation.  ...   more

 

	Typ SR 110 This machine is very effective since two slim rods are produced at the same time, using a double hole HF-coil connected to one generator. Every care has been taken to make the machine very operator friendly and to allow fast restart of pulling after harvest of the produced slimrods ...   more

Plasma Systems

 

Waferthinning

 

	PS 80 Plus Asyntis Chip Side Healing Back-Side Stress Relief (AES Process, active side faces dicing tape) Contact free exposing 3D-TSV (AES Process, active side faces dicing tape) Wafer and Die Thinning (AES Process, ...  more

 

	PS 4008 Asyntis / OEM The PS 4008 ASYNTIS/OEM is a remote cold plasma system based on microwave plasma generation. The manual machine is ideally suited for many different applications such as stress relief, special surface treatments and wafer thinning. In this plasma system ...  more

 

	Asyntis 2.2 Fully Automated Remote Plasma System ...  more

 

Photoresist Ashing

 

	GIGAbatch 310 M Serie Compact, price attractive bench top system for semiconductor applications, configured for universities and R&D labs. Suitable for various substrate sizes ranging from 2" to 6" wafers ...  more

 

	GIGAfab M Most compact version of the GIGAfab model family, targeting SU-8 Removal, MEMS Fabrication, Wafer Bumping and Flat Panel Display Technology ...  more

 

	GIGAfab A200/300 Automatic Single Wafer Asher for 200 or 300 mm Wafers, serving Semiconductor Device Fabrication, Wafer Bumping and MEMS Manufacturing. ...  more

 

	PS 210 The Microwave Plasma System 210 is our most popular full featured plasma surface modification system designed for laboratory and production use. The Microwave Plasma System 210 is ideal for ...  more

Chip Packaging

 

	PS 400/660 The Microwave Plasma Systems 400/660 Inline are the most versatile plasma cleaners in the world of chip packaging ...   more

 

	PS 400/660 IL The Microwave Plasma Systems 400/660 Inline are the most versatile plasma cleaners in the world of chip packaging ...   more

 

	PS 400 H2 The Microwave Plasma Systems 400/660 Inline are the most versatile plasma cleaners in the world of chip packaging ...   more

 

	GIGA 80 Plus GIGA 80 Plus is the only fully automatic Microwave Plasma System worldwide focused on the cleaning of individual substrates in semiconductor packaging.  GIGA 80 Plus is applicable as INLINE SOLUTION or as STAND ALONE TOOL ... more

 

Flat Panel Display

 

	PS 4011 The plasma system 4011 is designed for process development of flat panel displays. The chamber is loaded manually. The glass plates are easily placed ...   more

 

Wafermetrologie

 

	SIRD The introduction of the 300mm wafers has required further fab refinements, bringing also new standards for the suppliers of such of bare wafers: Increasing from 200 mm to 300mm diameter, the wafer has more than doubled it's surface ...  more

 

	TWIN The Implant process is a very critical step within the integrated circuits manufacturing line. It defines important characteristics and properties of the devices-to-be by doping certain layers of the silicon substrate. Rework processes ...  more

 

Ion Beam Etching

 

	RIBETCH 160 ECR This reactive ion beam etching system is used for microstructuring of microelectronic or electro-optical devices and is suitable for etching processes with argon ions (IBE) as well as for chemically reactive etching processes (RIBE, CAIBE). These systems.

 

Ultrasonic Measurement

PVA TePla also offers Ultrasonic Measurement for the nondestructive Inspection of High tech materials. Find more to this on the Homepage of our subsidiary PVA TePla Analytical Systems

www.pva-analyticalsystems.com

 

 

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