Chip Packaging

In chip packaging, plasma cleaning is essential for improving the cleanliness of bond pads prior to wirebonding. Ball shear and stitch pull strengths are dramatically enhanced by surface plasma cleaning. Ideally, during the pull test the wire should remain welded to the bond pad while it is broken midspan.

PVA TePla´s unique microwave plasma efficiently removes organic contaminants and thin oxide layers from the bond pads with unparalleled throughput. Microwave plasma processing allows for tailored surface cleaning and conditioning through the application of our proven and cost effective systems.

	Microwave Plasma System GIGA 80 Plus Fully automatic Microwave Plasma Cleaner for individual substrates. Applicable as INLINE SOLUTION or STAND ALONE TOOL. ... more

	Microwave Plasma System GIGA 690 The Plasma System GIGA 690 is a state-of-the-art plasma processing equipment. It is a PC-controlled ...   more

	Microwave Plasma Systems 400/660 Microwave Plasma System 400/660 Series for chip carrier cleaning in magazines  ...   more

	Microwave Plasma System 400 H2 Microwave Plasma System 400/660 Series with hydrogen generator for chip carrier cleaning in magazines. ...   more

	Microwave Plasma System 400 Inline Microwave Plasma System 400/660 Series for chip carrier cleaning in magazines  ...  more

	Plasma System GIGAfab Asyntis M GIGAfab ASYNTIS is a plasma etching system equipped with chamber downstream configuration and ...   more

Your service contact

PVA TePla AG
Plasma Systems
Ammerthalstr. 34

D-85551 Kirchheim

+49 (0) 89/905 03-0

email: plasma@pvatepla.com

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