Microwave Plasma System 400 Inline

The Microwave Plasma System 400 Inline is the most versatile plasma cleaner in the world of chip packaging.

Our unique microwave plasma process technology serves a broad spectrum of applications including plasma cleaning before wire bond, mold and solder ball attach, as well as prior to Flip Chip underfill and undermold.

Featuring electrode-free energy feeding and plasma generation, the 400 Inline system delivers unsurpassed flexibility. This electrode-free power coupling is key to the treatment of substrates in closed, non-slotted magazines in the downstream process.

Slotted magazines are processed perfectly on a rotating platform. In addition, the ECR mode is an extra function of these plasma systems.

As production tool the Microwave Plasma Systems 400 Inline provides high throughput and serve the full range of chip packaging applications.

The system is noted for its highly user-friendly interface and easily mastered operating platform. The Plasma System 400 Series is available with a hinged or sliding-type door design.

Technical Specifications

Plasma Chamber:	Aluminum W x H x D = 400 x 400 x 400 mm
Plasma Generation:	MW Frequency 2.45 GHz max. 1,000 Watt, variable power
System Dimension:	W x H x D = approx. 930 x 1,000 x 800 mm
Weight:	160 kg, Table Top Model
Options:	Vacuum Pump System Additional gas channels 3-4 Aluminum rotary platform, 350 mmØ
Related Applications:	Bond Pad Cleaning Flip Chip Underfill Encapsulation Solder Ball Attach