Resist Ashing System GIGAbatch 360 M / 380 M

Compact system in floor standing cabinet, manual drawer door. Designed for volume production at low COO, targeting fabrication of MEMS and HB-LEDs.

360 M : For all sizes up to 6" wafers

380 M : For 200 mm wafers

Quartz, Depth: 395 mm (15")

Diameter: 245 mm (9.6") - Model 360 M

Diameter: 300 mm (12") - Model 380 M

Microwave frequency 2.45 GHz

Max. power 1,000 W

W X H X D = 795 x 1540 x 710 mm

(32" x 61" x 28")

Weight: 190 kg (420 Ibs)

Certified Hydrogen gas option available

Photoresist Ashing
Substrate Cleaning

PVA TePla AG
Plasma Systems
Ammerthalstr. 34

D-85551 Kirchheim

Phone: +49 (0) 89/905 03-0

You can refer information material at our Download-Service , or address an inquiry at our Contact Form.