Single Wafer Asher GIGAfab A200/300

Automatic Single Wafer Asher for 200 or 300 mm Wafers, serving Semiconductor Device Fabrication, Wafer Bumping and MEMS Manufacturing.

Unique planar microwave plasma source geometry for best uniformity and high ash rates across a wide temperature range. Suitable for fluorinated gasses.

Modular platform configurable with various load port stations and chuck versions. Easy operation and maintenance.

Technical Specifications

Platform:	Base model includes single arm robot and open load port
Throughput:	35-80 w/h, depending on process Uniformity: +/- 5% across 300 mm for Descum
Chuck:	Wafer chuck with lift pins Temperature range: 100 - 280°C
Wafertransport:	Atmospheric transfer robot Single or dual loading stations for FOUP, SMIF or OLP (Open Load Port)
Plasma Generation:	Planar microwave plasma source for large area uniformity Frequency 2.45 GHz, max. 2,000W Variable power
Options:	Additional gas channels 3-4 Cooling chuck Certified Hydrogen Generator for Hydrogen operation Vacuum pump
Related Applications:	Photoresist Ashing, Descum Scrificial layer removal MEMS fabrisation Wafer bumping