Ashing of Photoresist

The removal of photoresist masks after processes such as etching and ion implantation, is one of the most important and frequently performed steps in front-end semiconductor manufacturing. Depending on the complexity of the devices concerned, the number of lithography cycles can vary typically from 10 to 25. Each cycle requires a photoresist removal process. This process of stripping the photoresist mask is carried out in a dry, eco-friendly process using plasma (‘ashing’). PVA TePla is the market leader for batch plasma ashers using microwave excitation and also offers Microwave Single Wafer Ashers. Microwave plasma is ideal for resist removal in modern device fabrication, since it produces a very high concentration of chemically active species along with low ion bombardment energy, guaranteeing fast ash rate and a damage-free plasma process at an economic cost level. Microwave plasma systems are suitable for all relevant substrate technologies like Si, III/V-compounds, quartz, ceramic, lithium niobate, copper interconnect devices etc. The inherently isotropic etch characterisitic is of advantage for sacrifical layer etch and SU-8 removal in MEMS fabrication.

Typical device markets served are:

Mixed signal devices, CMOS, Bipolar
Power devices
High Brightness-LEDs
MEMS, SAW-Devices, SU-8 removal
Flat Panel Displays (PLEDs)
III/V-compound materials
SiC-wafers
Nano Imprint Lithography, stamper clean

GIGAbatch Series

(GIGAbatch 310 M, GIGAbatch 360M / 380M, GIGAbatch 360P / 380P,
IonWave 10)

The GIGAbatch series is the latest and most advanced generation of batch ashers offered today. State-of the art process control in combination with microwave plasma generation are key elements of the GIGAbatch family of models. Starting at very economic prices, the systems range from R&D tools to fully-automatic loaded systems for high-volume production in Waferfabs up to 200mm. All models are equipped with the unique drawer door feature for easy loading without touching the plasma chamber.

	GIGAbatch 310 M The PS 300 series of microwave batch resist ashers ranges from manual to fully automated accommodating wafers from 2" to 8" (50 to 200 mm) ... more

	GIGAbatch 360M / 380M Compact system in floor standing cabinet, manual drawer door. Designed for volume production at low COO, targeting fabrication of MEMS and HB-LEDs ... more

GIGAbatch 360P / 380P

High-volume asher for advanced waferfabs, motorized door, ready for combination with a wafer transfer unit for sage and gentle automatic wafer loading. Of up to 50 wafers simultaneously, resulting in a ... more

	IonWave 10 The IonWave 10 is our most popular full featured plasma surface modification system designed for laboratory and production use ... more

	GIGAfab Series (GIGAfab M, GIGAfab A200/300) The GIGAfab series of single wafer tools complements the product range to serve the more demanding applications for 200 and 300 mm wafers, targeting wafer bumping, highdose implant strip and low temperature processing

	GIGAfab M Most compact version of the GIGAfab model family, targeting SU-8 Removal, MEMS Fabrication, Wafer Bumping and Flat Panel Display Technology ... more

	GIGAfab A200/300 Automatic Single Wafer Asher for 200 or 300 mm Wafers, serving Semiconductor Device Fabrication, Wafer Bumping and MEMS Manufacturing ... more