WAFERDÜNNEN

Diese Anlagen verbinden bewährte Elemente aus der Mechanik mit innovativen Elementen zur Prozesssteuerung. Beide Anlagentypen unterscheiden sich hauptsächlich in der Ausführung des Kristallvorschubs (Stange/Seil) und werden für die Produktion von Kristallen mit bis zu 6" Durchmesser eingesetzt. Die Abmessungen des Ofenkessels erlauben den Einbau von Heizeinrichtungen für Chargengewichte bis 80 kg. Aus dieser Einwaage gezogene Kristalle haben eine zylindrische Länge von etwa 1,5 m, woraus sich ca. 1.500 Wafer herstellen lassen.

PS 80 Plus Asyntisps

	Microwave Plasma System Series PS 300 (Models PS 300, PS 300 SA, PS 300 AL) The following three different variations are very compact, field proven plasma systems, mainly used for removing photoresist masks after ion implantation or etching processes, and in semiconductor production for wafer cleaning and descum.

Photoresist Ashing

	Microwave Plasma System Series PS 300 (Models PS 300, PS 300 SA, PS 300 AL) The following three different variations are very compact, field proven plasma systems, mainly used for removing photoresist masks after ion implantation or etching processes, and in semiconductor production for wafer cleaning and descum.

Chip Packaging

	Microwave Plasma System Series PS 300 (Models PS 300, PS 300 SA, PS 300 AL) The following three different variations are very compact, field proven plasma systems, mainly used for removing photoresist masks after ion implantation or etching processes, and in semiconductor production for wafer cleaning and descum.

Flat Panel Display

	Microwave Plasma System Series PS 300 (Models PS 300, PS 300 SA, PS 300 AL) The following three different variations are very compact, field proven plasma systems, mainly used for removing photoresist masks after ion implantation or etching processes, and in semiconductor production for wafer cleaning and descum.

Wafermetrologie

	Microwave Plasma System Series PS 300 (Models PS 300, PS 300 SA, PS 300 AL) The following three different variations are very compact, field proven plasma systems, mainly used for removing photoresist masks after ion implantation or etching processes, and in semiconductor production for wafer cleaning and descum.

Ionenstrahlätzen

	Microwave Plasma System Series PS 300 (Models PS 300, PS 300 SA, PS 300 AL) The following three different variations are very compact, field proven plasma systems, mainly used for removing photoresist masks after ion implantation or etching processes, and in semiconductor production for wafer cleaning and descum.

Solarzellenätzen

	Microwave Plasma System Series PS 300 (Models PS 300, PS 300 SA, PS 300 AL) The following three different variations are very compact, field proven plasma systems, mainly used for removing photoresist masks after ion implantation or etching processes, and in semiconductor production for wafer cleaning and descum.

RF Anlagen

	Microwave Plasma System Series PS 300 (Models PS 300, PS 300 SA, PS 300 AL) The following three different variations are very compact, field proven plasma systems, mainly used for removing photoresist masks after ion implantation or etching processes, and in semiconductor production for wafer cleaning and descum.