PS 4008 Asyntis / OEM

Manual Remote Microwave Plasma System

The PS 4008 ASYNTIS/OEM is a remote cold plasma system based on microwave plasma generation. The manual machine is ideally suited for many different applications such as stress relief, special surface treatments and wafer thinning. In this plasma system the dry etching effect is based on pure chemical reaction of reactive plasma particles (radicals) guided through the chamber downstream configuration.

The PS 4008 ASYNTIS/OEM system is easy to operate and features simple manual loading and unloading. The process does not require any additional substrate cleaning. The surface treatment is performed strictly by pure radical species. The electron-free and ion-free processing is the key factor for the successful treatment of extreme sensitive silicon substrates like NAND and DRAM. The plasma is generated by a 2.45 GHz Magnetron located about 60 cm above the wafer on top of the process chamber. Compatible with run all wafer sizes as well as 8” and 12” framed wafers.

This Tool is ideally suited for process development and pilot line production.

Technical specifications

Plasma Chamber:	Anodized Aluminum Diameter 460mm Volume: 80 liter
Plasma Generation:	MW Frequency 2.45 GHz max. 2,000 Watt variable power
System Dimension:	W x H x D = approx. 850 x 2,000 x 1,300 mm Weight: 550 kg
Optionen:	Additional gas channels Cooling units for MW and Check cooling Vacuum pump system
Related Applications:	Stress Relief Chip Side Stress Relief Post CMP Treat Ment Wafer Thinning Passivation

Applications

• Wafer Level Back-Side Stress Relief (active side faces backgrinding tape)
• Side Wall Die Etching (Chip Side Healing, CSH)
• Contact free exposing 3D-TSV (AES Process, active side faces dicing tape)
• Contact free exposing 3D-TSV (active side faces backgrinding tape)
• Wafer Level Back-Side Stress Relief (AES Process, active side faces dicing tape)
• Wafer Level and Die Level Thinning (AES Process, active side faces dicing tape)
• Wafer Level and Die Level Thinning (active side faces backgrinding tape)
• Dry and Damage free Wafer Dicing (AES Process, active side faces dicing tape)
• Dry and Damage free Wafer Dicing (Dicing by Etching DbE, active side faces up)
• Low Temperature Surface Passivation and Roughening
• Single chip treatment on tape
• Broken wafers treatment on tape