Planar Plasma System GIGAfab M

Most compact version of the GIGAfab model family, targeting SU-8 Removal, MEMS Fabrication, Wafer Bumping and Flat Panel Display Technology.

Featuring unique planar microwave plasma source technology and temperature-controlled substrate plate for large area processing in R&D and production. Suitable for uniform processing of single large or multiple substrates for Descum, Ashing and Surface Conditioning.

Certified Hydrogen gas option available.

Technical Specifications Plasma Chamber: Aluminum Cooled substrate plate:  310 x 310 mm Manual substrate loading on drawer   Plasma Generation:  Microwave frequency 2.45 GHz  Power max. 2,000 Watt  Variable power   System Dimension:  W x H x D = approx. 850 x 2,000 x 1,300 mm  Weight: 550 kg   Options: Additional gas channels Certified Hydron Generator for H2-operation Vacuum pump   Related Applications: Photoresist Ashing, Descum SU-8 Ashing Sacrificial layer removal     Business unit Semiconductor Systems     Your service contact   PVA TePla AG Plasma Systems Ammerthalstr. 34 D-85551 Kirchheim Phone: +49 (0) 89/905 03-0 E-mail: mailto:service.plasma@pvatepla.com       Downloads / Information Material   You can refer information material at our Download-Service , or address an inquiry at our Contact Form.   Go to top