Measurement Systems

 

Ultrasonic Measurement

 

PVA TePla offers a wide range of ultra sonic microscopy application systems for the inspection of high tech materials. Find out more about our systems at our homepage:

 

www.pva-analyticalsystems.com

 

 

 

 

Wafermetrology

PVA TePla AG offers several advanced measurement systems for monitoring semiconductor production processes: the SIRD System for shear stress measurement, Systems for defect detection on wafers or ingots, using scanning acoustic microscopy and the TWIN System for ion-implant dose monitoring. All of our systems are fully 300mm compatible and optionally compatible with full factory automation. They comply with all requirements of class 1 clean room as well as Semi standards S2 and S8and.

 

	SIRD A300 The introduction of the 300mm wafers has brought new standards for the suppliers of bare wafers: The increase to 300mm diameter has more than doubled the wafer surface area and weight ....  more

	TWIN A200 / A300 The Implant process is a very critical step within the integrated circuits manufacturing line. It defines important characteristics and properties of the devices-to-be by doping certain layers of the silicon substrate. Rework processes  ...  more

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