TWIN A200 / A300

The Implant process is a very critical step within the integrated circuits manufacturing line. It defines important characteristics and properties of the devices-to-be by doping certain layers of the silicon substrate. Rework processes is very difficult and often impossible to apply. Hence, constant quality monitoring of the implant process is inevitable in order to maintain device yield. The TWIN system can measure on monitor as well as on product wafers. It's measurement range covers the entire range from 10E10 to 5E16 of dose level with an implant energy level from 1keV bis 100 MeV.

Technical Specifications   Wafer Sizes: 50, 75, 100, 125, 150, 200, 300 mm   Throughput: 10 wph typically at 121 site map   Housing: Stainless Steel, clean room class 1 compatible   Laser Safety: Class 1   Power Requirements: 230 Volts, 1Ø, 50/60 Hz 8 amps maximum CE Certified Semi S2/S8 certified   Handling options: Open cassette handling system Bridging tool for different wafer sizes Pattern recognition software SMIF or FOUP load port optional Wafer ID-reader Host communication factory automation interface

Business unit

Semiconductor Systems

Your service contact

PVA TePla AG
Plasma Systems
Ammerthalstr. 34

D-85551 Kirchheim

Phone: +49 (0) 89/905 03-0

E-mail: service.plasma@pvatepla.com

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