Plasma Systems

Originating from the former TePla AG Feldkirchen (Munich), the division Plasma Systems designs, develops and builds production systems and customized plasma equipment. The division specializes in technologies used for surface cleaning and -activation, focusing on semiconductor technology, solar cell manufacturing, organic electronics and industrial and life science applications.

Photoresist Ashing

Photoresist Ashing
(GIGAbatch 310 M, GIGAbatch 360 M / 380 M, GIGAbatch 360 P / 380 P, IonWave10, GIGAfab M, GIGAfab A 200 / 300)

The removal of photoresist masks after processes such as etching and implantation, is one of the most important and frequently performed steps in front-end semiconductor manufacturing. Depending on the complexity of the devices concerned, the number of lithography ...

Flat Panel Display

	Pixel Activation (GIGAfab Gen 2) To assure the best pixel formation and maximum luminosity, the Ink Jet Printing of PLED Displays requires a very specific surface condition. This surface preparation is performed with PVA TePla’s direct microwave plasma technology, producing precisely ... more

Chip Packaging

	Bond Pad Cleaning (GIGA 690, PS 400/660, PS 400 Inline, PS 400 H2, GIGA 80 Plus GIGA Asyntis M) n chip packaging, plasma cleaning is essential for improving the cleanliness of bond pads prior to wirebonding. Ball shear and stitch pull strengths are dramatically enhanced by surface plasma cleaning. Ideally, during the pull test the wire should remain ... more

Wafer Thinning

Wafer Thinning / Wafer Stress Relief / Surface Passivation /
Post CMP Treatment
(PS 80 Plus Asyntis, PS 4008 Asyntis / OEM, Asyntis 2.2 )

or Stacking Dies, the final chip thickness is reduced to 30 µm and below. In production, however, these thicknesses cannot be achieved by grinding, especially since stress relief in high volume production becomes an important issue at 50 µm and below. ...

Solar Cell Etching

	Edge Isolation / Etching of Poly-Silicon (GIGA 690 Solar) Poly-silicon plasma etching for solar cell production has earned the reputation of being fast, reliable and above all economical. Plasma etching has proven itself as the most effective method to date for edge isolation and back-side nitride or ... more

RF Plasma

Widely used and versatile plasma technology
(M4L, 7200, M4L-DC, i-Mod, PlasmaPen, RoboPen, Custom)

Material surfaces that require cleaning, coating or chemical modification are immersed into the energetic environment of an RF plasma. Here they are subjected to chemically reactive species that are carried to their surfaces by the directional effects of the RF plasma. ...