Plasma System GIGA 80 Plus

GIGA 80 Plus is the only fully automatic Microwave Plasma System worldwide focused on the cleaning of individual substrates in semiconductor packaging. GIGA 80 Plus is applicable as INLINE SOLUTION or as STAND ALONE TOOL for strip handling from magazine buffers.

Featuring our unique microwave plasma technology, GIGA 80 Plus delivers the shortest possible processing times and damage-free substrate cleaning. This is also combined with unsurpassed uniformity and efficiency of the plasma impact. For instance, this strip-type plasma system is unparalleled in improving wire bond, mold, ball attach as well as Flip Chip underfill and undermold.

The Plasma System GIGA 80 Plus can accommodate any type of chip carrier and meets all requirements of today's chip packaging applications. Converting the substrate transportation system is user-friendly and easy.

A special highlight of GIGA 80 Plus is the superb jam detection system allowing processing of wire-bonded substrates and leadframes. This includes thinnest plastic packages or the most flimsy Cu leadframes.

The Microwave Plasma System GIGA 80 Plus also offers a compact footprint and is presented with an intuitive user interface.

Technical Specifications

Plasma Chamber:	Aluminum Inner Dimension 330 x 370 mm
Plasma Generation:	Microwave Frequency 2.45 GHz max. 1000 Watt Variable power
System Dimension:	W x H x D = Approx. 1700 x 2000 x 1500 mm
Weight:	750 kg
Options:	Additional gas channels 3-4 Vacuum pump system
Related Applications:	Flip Chip Underfill Bond Pad Cleaning Encapsulation Solder Ball Attach