Microwave Plasma Systems 400/660

The Microwave Plasma Systems 400 and 660 are the most versatile plasma cleaners in the world of chip packaging.

Our unique microwave plasma process technology serves a broad spectrum of applications including plasma cleaning before wire bond, mold and solder ball attach, as well as prior to Flip Chip underfill and undermold.

Featuring electrode-free energy feeding and plasma generation, the 400 and 660 systems deliver unsurpassed flexibility. This electrode-free power coupling is key to the treatment of substrates in closed, non-slotted magazines in the downstream process.

Slotted magazines are processed perfectly on a rotating platform.

In addition, the ECR mode is an extra function of these plasma systems.

Our process capability upgrade, introducing pure H2, is one more decisive benefit. It provides e.g. superior cleaning performance prior to wire bonding by removing oxide layers, sulphur residues or other inorganic impurities (H2 safety certificate available).

As production tools, the Microwave Plasma Systems 400 and 660 provide high throughput and serve the full range of chip packaging applications.

The systems are noted for their highly user-friendly interface and easily mastered operating platform. The Plasma Systems 400 and 660 are available with a hinged or sliding-type door design.