Resist Ashing System GIGAbatch 310 M

Compact, price attractive bench top system for semiconductor applications, configured for universities and R&D labs. Suitable for various substrate sizes ranging from 2" to 6" wafers. Prepared to accommodate horizontal carrier plates for wafers, small samples and quartz wafer boats.

Special cooled plate option for fast SU-8 removal.

Technical Specifications

Plasma Chamber:	Quartz, Diameter 245 mm Depth 395 mm
Plasma Generation:	Microwave frequency 2.45 GHz, max. 600 Watt Variable power
System Dimensions:	W x H x D = 795 x 650 x 710 mm Weight: 150 kg
Options:	SU-8 removal package, incl. wafer cooling plate and closed loop chiller for substrate temperature control, end point detector, extra gas line.
Related Applications:	Photoresist Ashing SU-8 Ashing Substrat cleaning