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Resist Ashing System GIGAbatch 360 P / 380 P

High-volume asher for advanced waferfabs, motorized door, ready for combination with a wafer transfer unit for sage and gentle automatic wafer loading. Of up to 50 wafers simultaneously, resulting in a throughput of more than 100 wafers/h for post-implant strip.

 

 

 

 
Technical Specifications

Plasma Chamber:

 

Quartz, Depth: 395 mm (15")

Diameter: 245 mm (9.6") - Model 360 P

Diameter: 300 mm (12") - Model 380 P

 

Plasma Generator:

 

Microwave frequency 2.45 GHz, 

max. power 1.000 W 

System Dimensions:

 

W x H x D = 795 x 1540 x 710 mm

(32" x 61" x 28")

Weight: 190 kg (420 Ibs)

 

Options: 

 

Certified Hydrogen gas option available

 

Related Applications:

 

 

 

Photoresist Ashing
Substrate Cleaning




 

 

Business unit

gb Semiconductor Systems

 

trenner

 

 

Your contact:

 

PVA TePla AG
Plasma Systems
Hans-Riedl-Strasse 5
D-85622 Feldkirchen

Phone: +49 (0) 89/905 03-0

E-mail: plasma@pvatepla.com

 

trenner

 

 

Downloads / Information Material

 

You can refer information material at our Download-Service , or address an inquiry at our Contact Form.

 


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