Planar Plasma System GIGAfab M

Most compact version of the GIGAfab model family, targeting SU-8 Removal, MEMS Fabrication, Wafer Bumping and Flat Panel Display Technology.

Featuring unique planar microwave plasma source technology and temperature-controlled substrate plate for large area processing in R&D and production. Suitable for uniform processing of single large or multiple substrates for Descum, Ashing and Surface Conditioning.

Certified Hydrogen gas option available.

Technical Specifications Plasma Chamber: Aluminum Cooled substrate plate:  310 x 310 mm Manual substrate loading on drawer   Plasma Generation:  Microwave frequency 2.45 GHz  Power max. 2000 Watt  Variable power   System Dimension:  W x H x D = approx. 850 x 2.000 x 1300 mm  Weight: 550 kg   Options: Additional gas channels Certified Hydron Generator for H2-operation Vacuum pump   Related Applications: Photoresist Ashing, Descum SU-8 Ashing Sacrificial layer removal       Business unit Semiconductor Systems     Your contact:   PVA TePla AG Plasma Systems Hans-Riedl-Strasse 5 D-85622 Feldkirchen Phone: +49 (0) 89/905 03-0 Email: plasma@pvatepla.com       Downloads / Information Material   You can refer information material at our Download-Service , or address an inquiry at our Contact Form.   Go to top