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Asyntis 2.2

Fully Automated Remote Plasma System

 

Asyntis 2.2  
Technical specifications

High throughput:


 up to 40 w/h @ 12”
 (3 µm removal incl. Passivation)
Versatile Substrates:

 6”, 8”, 12” and 8”
12”-Framed Wafers

 
High Uniformity:

  <= 7% @ 8”
  <= 10% @ 12”
Related Applications:

Stress Relief
Wafer Thinning
Passivation

 


 
Applications

 

  • Stress Relief (Wafer Backside and Chip Side)
  • Wafer Thinning
  • Passivation (Oxide, Nitride, mix)
  • Micro-Roughening (soft-rough to porous silicon)

Advanced Remote Plasma Applications:
  • 3M – TAIKO - Dicing - Wafer Thinning

 

 

 

Business unit

gb Semiconductor Systems

 

trenner

 

Your service contact

 

PVA TePla AG
Plasma Systems
Hans-Riedl-Str.5
85622 Feldkirchen

+49 (0) 89/905 03-0

email: service.plasma@pvatepla.com

 

trenner

 

 

Downloads / Information Material

 

You can refer information material at our Download-Service , or address an inquiry at our Contact Form.

 


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