Wafer Thinning / Stress Relief / Surface Passivation / Post CMP Treatment

For Stacking Dies, the final chip thickness is reduced to 30 µm and below. In production, however, these thicknesses cannot be achieved by grinding, especially since stress relief in high volume production becomes an important issue at 50 µm and below. The Cu-plugs for 3D-Interconnects require contact-free treatment without metal contamination.

For this application PVA TePla offers the advanced technology of wafer thinning by smooth remote plasma etching. With excellent uniformity we can extend our stress relief process for thinning the wafer. The ASYNTIS 2.2 is designed for high throughput in this advanced market. Wafer Thinning can be applied in-situ with Stress Relief and Passivation.

	PS 80 Plus Asyntis Chip Side Healing Back-Side Stress Relief (AES Process, active side faces dicing tape) Contact free exposing 3D-TSV (AES Process, active side faces dicing tape) Wafer and Die Thinning (AES Process, ... more

	PS 4008 Asyntis / OEM The PS 4008 ASYNTIS/OEM is a remote cold plasma system based on microwave plasma generation. The manual machine is ideally suited for many different applications such as stress relief, special surface treatments and wafer thinning. In this plasma system ... more