This particular type of machine was initially designed for the treatment of 300mm wafers within the Frontend of semiconductor production. Following the trend of wafer level packaging, this plasma system was recently re-designed also for the utilization within the Backend area.
The video shows the procedure when the robot arm handles a 300mm wafer between Front Opening Unified Pod (FOUP) station, pre-aligner, plasma chamber, cooling station and finally back into the FOUP.
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