Microwave Gas Plasma System GIGAfab ASYNTIS

GIGAfab ASYNTIS is a plasma etching system equipped with chamber downstream configuration and remote plasma generation. In this plasma system the dry etch plasma effect is entirely based on chemical reactions of reactive plasma particles. Moreover, GIGAfab ASYNTIS is featuring the unsurpassed capability of processing framed wafers, mounted on the tape. The mild, chemical remote plasma assures that the substrate temperature remains below critical values. The plasma system GIGAfab ASYNTIS can hereby handle wafer sizes up to 12”.

The very particular design of the tool is ideally suited for applications such as die strength improvement (Chip Side Healing), wafer stress relief as well as final wafer thinning. PVA TePla’s unique Advanced Etch Separation (A.E.S.) technology offers hereby all 3 processes in 1 step. In 3D-TSV manufacturing, GIGAfab ASYNTIS also performs perfectly. Silicon descum processes are highly uniform and can be well-controlled for small etch profiles (d < 10 µm). GIGAfab ASYNTIS is available as standalone tool for manual loading as well as for automated loading and unloading from wafer cassettes.

Technical Specifications

Plasma Chamber:	Aluminum W x H x D = 550 x 160 x 550 mm
Plasma Generation:	High Density Remote Plasma Source
System Dimensions:	W x H x D: ca. 850 x 2.000 x 1.300 mm
Weight:	550 kg (excl. pump)
Options:	Additional gas channels Vacuum pump Dry bed absorber
Related Applications:	Die strength improvement Wafer thinning and stress relief Wafer Dicing with Chip Side Healing