Quality Inspection & Metrology / Making Values Visible

Quality inspection using ultrasound, optical, laser, and VPD technologies enable non-destructive measurement and inspection of materials and components, primarily for the semiconductor industry.

Our Technologies

Determining Shearing Stress on Wafers


Our SIRD systems enable

  • Reliable monitoring of epitaxy reactors with a particular focus on the wafer edge region
  • Monitoring and optimizing of high-temperature or abrasive processes in the manufacturing of silicon wafers for semiconductor components, solar cells, and other materials for opto-electronic components
  • The evaluation of global stress or localized defects both on the entire silicon wafer as well as in defined areas

Inspection of Surface Contamination


With our VPD method (Vapor Phase Decomposition), we enable

  • Reliable analysis of wafers and semiconductor components to a concentration range of 107 at/cm²
  • Etching of the wafer surface with gaseous hydrogen fluoride (HF) to ensure absolute purity and safe handling of the HF gases.
  • Collection of contamination and concentration in a small droplet using the PAD scan. This module offers various scan patterns, advanced handling of droplets, and preparation of the subsequent analysis.
  • Preparation for the Analysis

Ultrasonic Inspection


Our SAM systems and software provide options for

  • Non-destructive testing of opaque (optically non-transparent) materials for quality and process control as well as for research applications
  • Fully-automated detection of cavities, voids, bubbles, inclusions, and delamination—particularly suitable for wafer inspection, bond checking, and MEMS inspection.
  • Combinations of ultrasonic microscopy and optical microscopy—particularly suitable for research and industrial applications
  • Analysis and evaluation of specific customer samples

Optical Quality Inspection


Our SPA systems and software offer the possibility of

  • guided, partially automated quality control by an operator
  • automatic loading of a wide range of semiconductor materials (silicon, sapphire, GaAs, GaN, glass, plastic, metal) onto optical measuring and testing devices
  • Fully automatic detection and measurement of structural deviations and anomalies in 3 dimensions – particularly suitable for wafer inspection, saw path inspection and edge chipping detection
  • Provision of customer-specific interfaces for data connection (SECS/GEM, Industry 4.0) – particularly suitable for integration into highly automated semiconductor factories

Immediate Contact

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PVA TePla AG
Im Westpark 10 - 12
D-35435 Wettenberg

Phone: +49 (0) 641/68690-0
Fax: +49 (0) 641/68690-800