- PVA TePla
- Technology Fields
- Quality Inspection
Our SIRD systems enable
- Reliable monitoring of epitaxy reactors with a particular focus on the wafer edge region
- Monitoring and optimizing of high-temperature or abrasive processes in the manufacturing of silicon wafers for semiconductor components, solar cells, and other materials for opto-electronic components
- The evaluation of global stress or localized defects both on the entire silicon wafer as well as in defined areas
With Hyperspectral Vision, we enable
- manufacturers to ensure quality, functionality, and cost-efficiency in industrial processes
- fast, non-destructive and comprehensive 100% inspection of performance surfaces and thin films (nm-µm)
- spatial resolved inspection of layer thickness and homogeneity, defects and cleanliness, and performance indicators
- the metrology and inspection of manufacturing processes (e. g. PVD, CVD, ALD) or modification processes (e. g. etching, doping, laser structuring)
- the analysis of wafers, metallic surfaces, polymers and glass
With our VPD method (Vapor Phase Decomposition), we enable
- Reliable analysis of wafers and semiconductor components to a concentration range of 107 at/cm²
- Etching of the wafer surface with gaseous hydrogen fluoride (HF) to ensure absolute purity and safe handling of the HF gases.
- Collection of contamination and concentration in a small droplet using the PAD scan. This module offers various scan patterns, advanced handling of droplets, and preparation of the subsequent analysis.
- Preparation for the Analysis
Our SAM systems and software provide options for
- Non-destructive testing of opaque (optically non-transparent) materials for quality and process control as well as for research applications
- Fully-automated detection of cavities, voids, bubbles, inclusions, and delamination—particularly suitable for wafer inspection, bond checking, and MEMS inspection.
- Combinations of ultrasonic microscopy and optical microscopy—particularly suitable for research and industrial applications
- Analysis and evaluation of specific customer samples
Our SPA systems and software offer the possibility of
- guided, partially automated quality control by an operator
- automatic loading of a wide range of semiconductor materials (silicon, sapphire, GaAs, GaN, glass, plastic, metal) onto optical measuring and testing devices
- Fully automatic detection and measurement of structural deviations and anomalies in 3 dimensions – particularly suitable for wafer inspection, saw path inspection and edge chipping detection
- Provision of customer-specific interfaces for data connection (SECS/GEM, Industry 4.0) – particularly suitable for integration into highly automated semiconductor factories