Default: Text & media (no synchronized slides)
The system / overview
PVA offers solutions for applications across all areas, ranging from manually loaded stand-alone single modules to fully integrated systems. These are divided into two product groups: WSPS (Wafer Surface Preparation System), which provides measurement and reference samples for external measurement equipment, and WSMS (Wafer Surface Measurement System), which utilizes an integrated ICP-MS to analyze the samples directly and automatically deliver the measurement results.
Bild-Format: 3 / 2
Bild-Größe: 1200 x 800 Pixel
Default: Text & media (no synchronized slides)
Driven by Partnership
PVA TePla collaborates with leading institutes, wafer manufacturers, and chip producers, continuously incorporating customer requirements and feedback into the development of its products.
Bild-Format: 3 / 2
Bild-Größe: 1200 x 800 Pixel
Default: Text & media (synchronized slides)
The system / overview
PVA offers solutions for applications across all areas, ranging from manually loaded stand-alone single modules to fully integrated systems. These are divided into two product groups: WSPS (Wafer Surface Preparation System), which provides measurement and reference samples for external measurement equipment, and WSMS (Wafer Surface Measurement System), which utilizes an integrated ICP-MS to analyze the samples directly and automatically deliver the measurement results.
Bild-Format: 3 / 2
Bild-Größe: 1200 x 800 Pixel
Default: Text & media (synchronized slides)
Driven by Partnership
PVA TePla collaborates with leading institutes, wafer manufacturers, and chip producers, continuously incorporating customer requirements and feedback into the development of its products.
Bild-Format: 3 / 2
Bild-Größe: 1200 x 800 Pixel
Default: Text & media (synchronized slides)
The system / overview
PVA offers solutions for applications across all areas, ranging from manually loaded stand-alone single modules to fully integrated systems. These are divided into two product groups: WSPS (Wafer Surface Preparation System), which provides measurement and reference samples for external measurement equipment, and WSMS (Wafer Surface Measurement System), which utilizes an integrated ICP-MS to analyze the samples directly and automatically deliver the measurement results.
Bild-Format: 3 / 2
Bild-Größe: 1200 x 800 Pixel
Default: Text & media (synchronized slides)
Driven by Partnership
PVA TePla collaborates with leading institutes, wafer manufacturers, and chip producers, continuously incorporating customer requirements and feedback into the development of its products.
Bild-Format: 3 / 2
Bild-Größe: 1200 x 800 Pixel