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The system / overview

PVA offers solutions for applications across all areas, ranging from manually loaded stand-alone single modules to fully integrated systems. These are divided into two product groups: WSPS (Wafer Surface Preparation System), which provides measurement and reference samples for external measurement equipment, and WSMS (Wafer Surface Measurement System), which utilizes an integrated ICP-MS to analyze the samples directly and automatically deliver the measurement results.

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Bild-Größe: 1200 x 800 Pixel

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Driven by Partnership

PVA TePla collaborates with leading institutes, wafer manufacturers, and chip producers, continuously incorporating customer requirements and feedback into the development of its products.

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WSPS system
WSPS pad

Default: Text & media (synchronized slides)

The system / overview

PVA offers solutions for applications across all areas, ranging from manually loaded stand-alone single modules to fully integrated systems. These are divided into two product groups: WSPS (Wafer Surface Preparation System), which provides measurement and reference samples for external measurement equipment, and WSMS (Wafer Surface Measurement System), which utilizes an integrated ICP-MS to analyze the samples directly and automatically deliver the measurement results.

Bild-Format: 3 / 2
Bild-Größe: 1200 x 800 Pixel

Default: Text & media (synchronized slides)

Driven by Partnership

PVA TePla collaborates with leading institutes, wafer manufacturers, and chip producers, continuously incorporating customer requirements and feedback into the development of its products.

Bild-Format: 3 / 2
Bild-Größe: 1200 x 800 Pixel

Next
WSPS system

Default: Text & media (synchronized slides)

The system / overview

PVA offers solutions for applications across all areas, ranging from manually loaded stand-alone single modules to fully integrated systems. These are divided into two product groups: WSPS (Wafer Surface Preparation System), which provides measurement and reference samples for external measurement equipment, and WSMS (Wafer Surface Measurement System), which utilizes an integrated ICP-MS to analyze the samples directly and automatically deliver the measurement results.

Bild-Format: 3 / 2
Bild-Größe: 1200 x 800 Pixel

Default: Text & media (synchronized slides)

Driven by Partnership

PVA TePla collaborates with leading institutes, wafer manufacturers, and chip producers, continuously incorporating customer requirements and feedback into the development of its products.

Bild-Format: 3 / 2
Bild-Größe: 1200 x 800 Pixel

Next
WSPS system
WSPS pad