Physical Vapor Transport
Physical Vapor Transport (PVT) is an established process for producing high-purity and low-defect single crystals, especially of compound semiconductors such as silicon carbide (SiC) and aluminum nitride (AlN), which cannot be produced using other processes such as Czochralski, or only with great difficulty. Due to its ability to enable excellent crystal quality, PVT technology is a key factor for the modern semiconductor industry. The continuous development of the PVT process, including variants such as the Lely method, aims to optimize growth conditions and continuously improve material properties.
Relevant industries
Power Electronics
High-performance compound semiconductors enable efficient and reliable devices for applications in power electronics with high voltages and temperatures and promote the miniaturization and energy efficiency of modern electronics. Typical applications can be found in e-mobility or renewable energies.
Optics
Semi-insulating SiC materials are used for example in AR glasses precisely controlling the refractive properties of optical components, enabling sharp visuals and enhanced user experiences.
Optoelectronics
Our systems are the advanced equipment for producing high-quality substrates, forming the foundation for LEDs and other optoelectronic devices. This enables innovative applications in lighting and sensor technology.
Energy
Silicon carbide (SiC) semiconductor devices are used in the energy sector as high‑performance power electronics, particularly in electromobility applications such as inverters and onboard chargers for electric vehicles, as well as fast‑charging infrastructure. They are also deployed in power converters for renewable energy systems and for improving the efficiency of industrial drives, including railway traction systems.
Compared to conventional silicon chips, SiC power semiconductors offer higher efficiency due to reduced switching losses, enable more compact system designs, and provide superior thermal stability, allowing operation at significantly higher temperatures. These characteristics result in lower energy losses, reduced cooling requirements, and overall more powerful and lightweight system architectures.
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