Semiconductor

The quality of electronic components begins with the purity of their raw materials. Our processes for synthesizing and purifying materials such as graphite create optimal conditions for crystal growth. In the semiconductor industry, ultra-pure graphite is essential, for example for susceptors and heaters in silicon crystal growth systems.

Semiconductor crystals such as silicon, germanium, SiC, AlN, and GaN are the basis of modern electronics. Our systems for standard crystal growth processes produce ultra-pure single crystals with precisely defined properties for applications in microelectronics, power electronics, photovoltaics, and sensor technology.

Plasma treatments improve the surface properties of MEMS components and support their functionality and durability. They are used in the production of microelectromechanical systems, for example in automotive sensor technology and in acceleration and pressure sensors for smartphones.

For many semiconductor components, optimal surface properties are crucial—whether to improve the adhesion of layers or to increase corrosion resistance. Our plasma treatments enable targeted modifications, for example for housings or circuit boards.

Chemical vapor deposition (CVD) produces durable ceramic protective layers that safeguard components against wear, corrosion, and high temperatures. These coatings are essential for the longevity and reliability of sensitive components in semiconductor manufacturing.

Non-destructive scanning acoustic microscopy enables the precise detection of invisible defects, delaminations, and voids in semiconductor components. This ensures the highest quality and reliability in the mass production of microchips and power semiconductors.

The SIRD system enables fast, contactless, non-destructive measurement of stress fields and defects in semiconductor wafers. Using the photoelastic effect, it detects global stress distributions and local defects such as dislocations and cracks. This supports process understanding and quality control for materials including SiC, GaN, and silicon.

VPD technology enables highly sensitive detection of trace elements and contaminants on semiconductor surfaces. This helps meet the extreme purity requirements of chip production and supports quality control during wafer manufacturing. Detecting defects at an early stage can significantly reduce manufacturing costs.

The technology inspects wafers in less than 10 seconds and provides spatially resolved data on layer thickness, contamination, and surface properties. As an optics-based method, it is suitable for production wafers. It enables fast, contactless inspection of semiconductor integration and PCB assembly quality, including solder paste residues, oils, greases, and oxidation states.