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Clean. Treat. Activate.

Plasma Surface Treatment

Technology Overview

Plasma Surface Treatment

PVA TePla is a leading expert in plasma surface treatment, offering world-class technology and enjoying high customer acceptance in all dry etching applications, both frontend and backend.

Pulse Plasma Nitriding

Plasma nitriding enriches component surfaces with nitrogen and/or carbon to enhance resistance to wear and corrosion.

Pulse Plasma Nitriding
Interior of a plasma frontend showing multiple wafers being inserted into a cylindrical holder.

Plasma Frontend

Frontend plasma technology enables essential wafer cleaning and surface preparation in semiconductor manufacturing.

Plasma Frontend
Plasma backend system detail view showing metallic electrode grid and interior components.

Plasma Backend

Plasma backend processes enable efficient cleaning and activation of semiconductor components during chip packaging.

Plasma Backend
Laboratory power/control box with front-panel controls and attached coiled cable

Atmospheric Plasma Cleaning

Atmospheric plasma is an advanced surface treatment technology that enhances materials through efficient cleaning, activation, and functionalization at ambient pressure.

Atmospheric Plasma Cleaning
Compact plasma processing unit with door open to reveal multiple loading trays and a touchscreen display

Plasma Cleaning and Activation

Vacuum plasma cleaning and activation use low-pressure ionized gas to gently prepare surfaces for improved adhesion and performance.

Plasma Cleaning and Activation
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