Float-Zone process
Also known as the “zone melting process,” the floating-zone technology is used for the production of ultra-high purity monocrystalline silicon (achieving purities of up to 11N), as primarily used in components for high-performance electronics, microsystems technology, and semiconductor technology. The polysilicon industry, solar industry, and R&D sectors also benefit from this technology. The advantage of the FZ process over methods using quartz crucibles (quartz = silicon dioxide) is the significantly lower contamination with oxygen. There are also no additional costs for single-use crucibles.
Relevant industries
Semiconductor
Due to its low defect density and high electrical mobility, float-zone silicon is particularly suitable for components in high-frequency technology, such as mobile phone base stations and radar systems.
Power Electronics
Floatzone silicon is used in the production of power semiconductors such as diodes, thyristors, IGBTs, and MOSFETs. These components are used in power supplies, inverters, drive systems, and energy transmission.
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