Scanning Acoustic Microscopy

Scanning Acoustic Microscopy

Acoustic microscopy offers the unique advantage of examining the internal structure of a material non-destructively — such as ingots in the production of wafers and MEMS devices, which are opaque to infrared or X-ray methods. By measuring variations in acoustic impedance within the specimen, this technique generates clear contrasts that reveal hidden features. One notable property is the complete reflection of sound waves at air inclusions, producing bright signals and phase shifts. As a result, acoustic microscopy is highly effective in identifying material defects such as microcracks, inclusions, gas bubbles, and delamination, supporting quality assurance and advanced materials analysis.

 

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The process

Acoustic microscopy is based on the pulse-echo principle, in which a high-frequency transducer transmits rapid ultrasonic pulses and receives the returning signals. The transducer contains a piezoelectric element that converts electrical signals into precise ultrasonic waves. These waves are coupled into the sample via a coupling medium — such as deionized water. The ultrasonic waves are focused onto the sample, and reflections from internal structures are captured by the transducer. An analog-to-digital converter (ADC) digitizes the received signals, while advanced trigger electronics control the transmission and reception cycles. The result is a high-resolution, non-invasive imaging of the sample's interior, displayed as a grayscale image.

Data Acquisition by transducer

Systematic and very precise

The transducer scans the sample line by line (in grids) on the XY plane and on request — in case of samples with bows or protruding elements — in the Z direction and then displays the electromagnetic pulses as pixels with specific gray values.

The information from the individual pixels is used to generate an image showing all the recorded signals. To begin with, the ultrasound reflection at the sample surface is displayed. If the sample is intact, the signal is reflected again a second time at the rear side of the sample. The time difference of arrival of the two signals from the upper and lower side of the sample yields information about its thickness. If the sample contains a defect, this interface — between sample and defect — will also cause sound reflection to occur.

Frequency und Resolution

Unrivaled and Specific

Acoustic microscopy operates using frequencies that extend to the gigahertz range. As a general rule, the higher the frequency, the greater the achievable resolution and the lower the penetration depth of the sound waves.

Since the attenuation in the coupling media increases quadratically as the frequency rises, the lens must be brought as close as possible to the sample under investigation. This low working distance and the difficulty of creating transducer arrangements offering high local resolution require a type of scanning microscopy in which the sample is investigated pixel by pixel.

The ongoing further development of their high-resolution transducers enables Analytical Systems to improve the measurement accuracy. The ultrasound microscopes currently offer the highest frequency range up to a maximum of 1,000 MHz, delivering resolutions all the way down to 0.8 µm. Naturally, this depends on the material and the density of the sample to be investigated.

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SAM system with multiple transducers inspecting a semiconductor wafer.

Execution of non-destructive analyses

Scan modes of ultrasonic microscopy

Scanning modes - also known as imaging modes - can perform non-destructive analyses of the internal structure of components under the acoustic microscope. In particular, these imaging modes help to explain the individual layers and structures of components for delamination and crack detection. To get detailed insights, different imaging or scanning modes are used. 

Overview of Scan Modes

The A-scan provides local time of flight from the sample — a time-dependent ultrasonic wave reflected by the component. This information digitizes the selected sample range by means of a previously selected data gate. This data gate for the quantitative time-distance measurement (echo time) is used to set electronic time windows in the depth. Appropriately selected ranges are then incorporated into the C-scan. A digital oscilloscope on the screen represents the incoming echo. If more than one time window is placed (X- or G-scans), multiple images are displayed on the monitor.

In principle, the B-scan involves stringing together A-scans. They produce a depth-resolved cross-section image of the component in the X direction. The gate is set for the entire time range, but can be configured by the user. With the help of the SAMnalysis software, additional options for the B-scan analysis are provided.

In this case, the gate is set at a specific depth and width (controlled in WINSAM). Scanning the component in the X and Y directions generates a stratified image of the component, whose width corresponds to that of the set data gate. In the event of delaminated surfaces, this area can be marked red immediately (display of phase inversion).

In the X-scan, more than 100 C-scan images of varying depth ranges can be generated simultaneously and displayed in real time during one scanning operation.

The Z-scan mode acquires three-dimensional data records (tomographic information) and enables off-line reconstructions of B-, C-, D-, P-, X-, A-, and 3D-scans as well as runtime measurements of the images with user-selectable gates. These can then be processed by the SAMnalysis and WINSAM software.

A transducer positioned above the sample emits an ultrasound signal, which is detected by a second transducer below the sample. This scanning mode provides the user with information about the structure of the sample. In this process, both transducers analyze the sample simultaneously.

Key Application Areas

With high-frequency ultrasound, SAM covers the full manufacturing chain: from wafer inspection and power device inspection to metrology of today's most advanced semiconductor packaging architectures. The following sections outline these key application areas in which SAM provides decisive added value throughout the entire manufacturing chain.

Array of scanning acoustic microscopy (SAM) transducers aligned above a sample surface for high‑precision, non‑destructive inspection.

Precision from the first step

Wafer Inspection

SAM detects subsurface defects such as delaminations, voids, and micro-cracks in wafers at an early stage — invisible to optical methods. High-frequency ultrasound ensures reliable inspection of thin layers and fine structures.

Applications: Silicon, SiC, and compound semiconductor wafers before or after critical process steps such as thinning, dicing, or epitaxy.

Close‑up of a scanning acoustic microscopy process

For high‑performance modules

Power Device Inspection

SAM analyzes the mechanical integrity of multilayer structures in power devices — detecting delaminations, cracks, porosity, and voids in die-attach layers, DBC/AMB substrates, and packaging interfaces to ensure lifetime and thermal performance.

Applications: Power modules for automotive, industrial, and e-mobility, as well as SiC power components.

For the next performance generation

Advanced Packaging Inspection

SAM enables high-resolution inspection of fine structures such as micro-bumps, TSVs, underfill interfaces, and interposer layers — ensuring the integrity of electrical interconnects in 2.5D/3D chip architectures.

Applications: High-performance chips, HBM stacks, CoWoS/SoIC packages, and flip-chip architectures.

Relevant industries

Energy

Scanning acoustic microscopy enables reliable, non-destructive inspection of power electronics and semiconductor components for the energy industry, ensuring quality and safety for critical applications. This technology detects internal defects such as delaminations, voids, cracks, and bonding issues in modules like IGBT, heat sinks, thin film layers, and advanced semiconductor devices.

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Automotive

Non-destructive, comprehensive testing is essential for safety-critical automotive assemblies and components. As electric mobility advances, new technologies and power electronics in cars, ICEs, and trains must meet stringent quality standards. Our systems check compound materials, power electronics, sensors, control devices, seals, and welded, soldered, and sintered connections.

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Semiconductor

Our systems provide non-destructive structural mapping to detect defects and connection errors in semiconductor production, supporting applications from frontend to backend. Typical checks include wafers, SiC and Si ingots, MEMS, die structures, microprocessors, LEDs, flip chips, power electronics, bonded interfaces, CMOS sensors, molded and passive components, and packaging.

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Medical

Non-destructive acoustic microscopy reveals subsurface structures in medical samples without pretreatment, enabling reliable, high-quality analysis of implants, bones, tissue, cells, thrombus formation, and teeth. Ongoing collaboration with leading research institutes ensures continuous technological advancement for medical applications.

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Acoustic Microscopy. Engineered for Excellence.

From laboratory instruments through to semi-automated devices all the way to fully automated systems, by combining ground-breaking technologies and sophisticated engineering solutions, we develop high-performance acoustic microscopes and software that can be optimized to suit your investigation requirements and materials. Our versatile SAM product lines are characterized by intuitive analysis technologies — made in Germany with an unmatched price-performance ratio.

The basis of our ultrasound technology forms a common component platform, which is completed by application-specific modules for individual solutions. They differ in terms of their hardware (optionally expandable), scanner type and its travel, as well as the transducer. As a matter of principle, our transducers are compatible with all systems.

Beyond SAM systems, our expertise extends to advanced Ultrasonic NDT systems designed for larger, complex components and industrial inspection tasks. These systems build on the same core ultrasound platform while offering multi‑axis motion, expanded scan envelopes, and application‑specific automation for high‑precision evaluation across diverse part geometries.

 

To our Ultrasonic NDT systems

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Lab worker operates scanning acoustic microscopy process in a clean, bright laboratory while another person walks in the background.

The systems at a glance

SAM Lab system shown from the front

SAM Lab

The SAM Lab offers easy-to-operate scanning acoustic microscopes for process control, quality assurance, and research applications. Each model is built on an industry-standard component platform utilizing leading production and manufacturing technologies.

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SAM Auto-Wafer system from the front with monitor

SAM Auto Wafer

The SAM Auto Wafer series is a dedicated, non-destructive system for automated wafer inspection and process control. Sample analysis using four dual array transducers enables high-resolution acoustic investigations with high throughput, leveraging new high-frequency and transducer technologies with frequencies up to 400 MHz and pulser repetition rates of up to 80 kHz.

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PVA TePla Auto-Tray system featuring an enclosed automated handling unit with robotic mechanisms for loading and transferring trays.

SAM Auto Tray

The manufacturing of electronic devices, printed circuit boards, IGBT modules, and other complex components critically depends on bonding, soldering, and potting processes. SAM Auto Tray enables non-destructive inspection of these components for related defects.

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Automated scanning acoustic microscopy system for high‑volume panel inspection.

SAM Auto Panel

The SAM Auto Panel is specifically designed for process control in semiconductor manufacturing, with a particular focus on monitoring panel-level packaging (PLP) and panel-based semiconductor technologies, as well as other complex components.

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