Plasma Cleaning & Activation

A vacuum plasma system uses low-pressure gas and RF power to generate reactive species that clean, activate, or modify surfaces without high heat. Applications include removing organic residues, increasing surface energy for better bonding, improving adhesion for coatings and inks, photoresist descum/ashing in electronics, and preparing polymers, metals, glass, and ceramics for assembly. It delivers uniform, repeatable treatment with recipe control (pressure, gas, power, time), supporting industries like semiconductors, electronics, medical devices, automotive/aerospace, and general manufacturing.

 

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The process

Plasma surface treatment converts surfaces using reactive species at low pressure:

Etching: removes material with chemically assisted ion reactions.

Cleaning: strips organic residues/contaminants.

Activation: creates polar groups, raising surface energy for bonding/printing.

Passivation: forms protective layers to inhibit corrosion or reactivity.

Functionalization: grafts specific chemical groups for targeted adhesion or biocompatibility.

Deposition: forms thin films (e.g., PECVD) for barriers, dielectrics, or adhesion promotion.

All processes are recipe‑controlled (gas, pressure, power, time) for uniform, repeatable results.

How does it work?

Plasma surface treatment energizes a gas at low pressure to create ions and radicals that clean and modify only the top molecular layers. It removes residues, raises surface energy for stronger bonding, and can add protective or functional groups or deposit thin films. In semiconductors, it enables low‑damage photoresist ashing, via cleans, adhesion boosts for die attach/underfill, and pre‑dep cleans that improve PECVD/ALD nucleation—delivering uniform, repeatable results via precise control of gas, pressure, power, and time.

What do you get?

Customers receive the following with a PVA TePla IoN Series Vacuum Plasma System:

  • Turnkey low‑pressure plasma system with chamber, vacuum pumps, RF power, matching network, MFCs, and HMI/PLC controls
  • Preloaded, recipe‑controlled processes (cleaning, activation, descum) with data logging and audit trails
  • Application support: process development, sample runs, and onboarding guidance
  • Fixturing options for uniform treatment of diverse part geometries
  • Safety features: interlocks, vacuum/gas monitoring, CE/UL‑aligned practices
  • Installation, training, and North American service/spares
  • Documentation: manuals, FAT records, and qualification support (uniformity mapping as applicable).
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AI-generated illustration of a semiconductor wafer with glowing blue energy effects.
AI-generated illustration of a bright blue plasma burst inside a chamber.
AI-generated illustration of a wafer inside a glowing plasma chamber.

Relevant industries

Plasma surface treatment serves Semiconductor, Medical Device, Lifesciences, Electronics, Defense, Aerospace, and Automotive markets. It cleans, activates, etches, and functionalizes surfaces for reliable bonding, coating, and assembly—supporting photoresist removal, via cleans, catheter adhesion, biocompatible finishes, rugged electronics, lightweight aerospace composites, and high‑durability automotive components with uniform, low‑temperature, recipe‑controlled processes.

Semiconductor

Vacuum plasma enables surface cleaning and activation across the full semiconductor manufacturing flow — from bulk photoresist ashing, descum, and SU-8 etching, through wafer-to-wafer and die-to-wafer direct bonding pretreatment, generating high-energy hydrophilic interfaces for strong, void-free bonds. In back-end and advanced packaging, plasma removes native oxides for solder bump activation, improves underfill wetting, and reduces flip-chip voids. Prior to wire bonding, plasma cleans and conditions lead frames, bond pads, and die surfaces, with further applications including EMC adhesion promotion, TSV sidewall cleaning, and RDL surface preparation.

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Optics

Vacuum plasma cleans and prepares optical surfaces — including lenses, prisms, fiber optics, and gratings — improving both transmittance and reflectance. It is equally effective as a pretreatment to promote adhesion of anti-reflection, filter, and protective coatings.

Optoelectronics

Vacuum plasma supports optoelectronic device fabrication through resist ashing, descum, passivation preparation, and ohmic contact activation. It is used for backside thinning and cleaning in BSI image sensors, activation prior to anti-reflection coatings, and surface preparation before metallization and hydrogen passivation. Packaging applications include TO-can and surface mount package cleaning, optical window cleaning, fiber pigtail attachment preparation, and lens element activation.

Power Electronics

Vacuum plasma is essential in wide bandgap power device fabrication, enabling SiC etching, GaN HEMT surface passivation, gate oxide preparation in MOSFETs, and resist ashing for device patterning. It is equally critical for ohmic and Schottky contact preparation, lead frame and substrate activation, die attach surface preparation, and encapsulant and gel adhesion in power module packaging.

Energy

Plasma is used across multiple energy technology sectors. In solar and photovoltaics, it enables silicon surface passivation, electrode cleaning for improved battery efficiency, and separator membrane activation to reduce internal resistance. In fuel cells, plasma activates polymer electrolyte membranes, improves bipolar plate hydrophilicity and water management, and prepares surfaces prior to catalyst deposition and layer bonding. In power module packaging, plasma ensures void-free solder and sinter joints critical for thermal management in high-power energy conversion systems.

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Aerospace & Defense

Vacuum plasma is used in aerospace and defense for photoresist ashing, descum, and critical cleaning applications where ultra-clean or high-energy surfaces are required for bonding, coating, or painting. It effectively replaces solvent wiping and mechanical abrasion, reducing labor and chemical usage while preparing metal surfaces for adhesive bonding, thermal spray coating, and anodizing without affecting tight dimensional tolerances. Plasma is also widely used in IR and UV detector preparation for tracking systems and sensors, and for conformal coating preparation on avionics PCBs — ensuring complete, void-free coverage for long-term durability in demanding environments.

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Automotive

Vacuum plasma is increasingly used in the production of electronic components, sensors, and power electronics in modern vehicles, where rising complexity and precision demand consistently clean and activated surfaces. It is widely applied to resolve adhesion challenges across the broad range of dissimilar materials used in automotive manufacturing — from bonding polymers and composites to preparing metal surfaces for structural adhesives.

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Medical

Plasma is widely used in medical applications ranging from well plates and microfluidics to catheters and implantable devices, making normally non-wettable surfaces bondable and functional. It is used to deposit thin films that fundamentally alter surface properties — from enabling DNA binding on polymer surfaces to creating drug-eluting and chemical-resistant coatings. Plasma is equally effective at preventing unwanted surface adhesion in applications where cell or protein attachment to a surface would inhibit the desired biological or diagnostic outcome.

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IoN Plasma Systems

A vacuum plasma system uses low-pressure gas and RF power to generate reactive species that clean, activate, or modify surfaces without high heat. Applications include removing organic residues, increasing surface energy for better bonding, improving adhesion for coatings and inks, photoresist descum/ashing in electronics, and preparing polymers, metals, glass, and ceramics for assembly. It delivers uniform, repeatable treatment with recipe control (pressure, gas, power, time), supporting industries like semiconductors, electronics, medical devices, automotive/aerospace, and general manufacturing.

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ion series

The ION SERIES at a glance

IoN 40

IoN 40 plasma system

The IoN 40 plasma system is a 40 liter aluminum plasma reactor designed for R&D and production applications. It offers some of the most advanced and innovative solutions for a wide variety of applications.

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IoN 40q

IoN 40Q plasma system

The IoN 40Q plasma system is a 40 liter quartz barrel type plasma reactor. It is designed for batch processing wafers for photoresist strip, descum, nitride etch and other cleaning applications in semiconductor, LED, and MEMS fabrication. Today’s IoN 40Q is designed to meet the evolving demands of our customers, emphasizing versatility and control for their surface treatment needs. 

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IoN 10q

IoN 10Q plasma system

The IoN 10Q plasma system is a 10 liter quartz barrel plasma reactor designed for R&D and production applications. It offers some of the most advanced and innovative solutions for a wide variety of applications.

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IoN 100

IoN 100 plasma system

The IoN 100 plasma system is a 100 liter aluminum plasma reactor designed for R&D and production applications. The IoN 100 uses a larger chassis that provides all the gas and power connections.

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IoN custom series

IoN Custom series

The IoN Custom series delivers fully tailored, production-grade plasma systems engineered around your specific substrate and process requirements — where standard chambers and generic electrode designs simply cannot perform.

When your application demands performance beyond the limits of standard equipment, the IoN Custom series provides a future-proof, production-ready platform designed from the ground up for your process.

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