Scanning Acoustic Microscopy

Our Scanning Acoustic Microscopy (SAM) service provides high‑resolution, non‑destructive ultrasonic imaging for analyzing the internal structure of bonded, brazed, or composite components. SAM enables the precise detection of hidden defects that cannot be identified using other inspection technologies.

Find out more about the technology

Advanced ultrasonic transducers deliver insights into:

Internal defects such as voids, delaminations, cracks, and inclusions
Quality and uniformity of diffusion‑bonded or vacuum‑brazed joints
Adhesion layers and laminate interfaces
Composite material structures and multi‑layer assemblies

Our experts evaluate your components using optimized acoustic parameters and provide graphical analyses and comprehensive test reports for clear, actionable insights.

With SAM, PVA TePla supports material qualification, process validation, and the reliable assessment of product integrity across a wide range of industries — from semiconductor production to high‑precision manufacturing.

Close‑up of a scanning acoustic microscopy process

Interested in SAM analysis service?

Get in touch

Conatct Form