Configurations

Plasma Batch Type Systems

  • GIGA 690 

  • GIGA 690 Inline

  • GIGA 690 Autofab

The versatile GIGA 690 is a reliable batch backend tool. It is used as a common platform to cover different tasks, from a standalone single solution up to fully automated cluster system.

The substrates / products will be treated in a batch type product carrier.

Applications

GIGA 690, GIGA 690IL and GIGA 690 Autofab

BGAs, lead frames, PCBs and wafers

  • Activation before molding, underfill, coating

  • Cleaning before wire bond

  • Pre flip chip underfill

  • Pre solder ball attach

  • Substrate & wafer cleaning / activation

  • Up to 6 magazines batch processing

Others

  • Substrate cleaning / activation of alternative products like sensors, medical components and other parts

Advantages

GIGA 690 and GIGA 690 Inline

  • Flexibility: broad spectrum of applications and possibilities

  • GHz plasma, aluminium chamber, ceramic window

  • No electrodes inside chamber

  • 2 different chamber sizes (64 or 91 litres)

Advantages

GIGA 690 AutoFab

  • Fully automated cluster solution

  • High throughput at small footprint through ingenious combination of batch treatment and single wafer automation

  • Bullet proof plasma technology with best uniformity results

Next
Technical Data
PowerDifferent voltages and frequencies available
Process gas¼“ Swagelok-connector, input pressure 1 - 2 bar
Inner Dimension (WxHxD)400 x 400 x 400 mm (optional 450 x 450 x 450 mm)
Compressed airConnector 6 mm Festo, input pressure 4 - 6 bar, oil free
Dimensions (WxHxD)1,050 mm x 1,720 mm (1,950 mm incl. light tower) x 815 mm
Weight195 kg (445 kg incl. vacuum pump)


Download brochure

PowerDifferent voltages and frequencies available
Process gas¼“ Swagelok-connector
Compressed airConnector 6 mm Festo, input pressure 4 - 6 bar, oil free
Dimensions (w/h/d)1,700 mm x 2,000 mm (incl. light tower) x 2,000 mm
WeightApprox. 795 kg (incl. vacuum pump)


Download brochure

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