Plasma Strip Type Systems

• 80Plus
  2.45 GHz for chemical etch characteristic
  Strip-type automation with a flat, large plasma chamber

• 80Plus IoN
  With RF 13.56 MHz for physical surface treatment via ion bombardment

• 80Plus HS
  2.45GHz for chemical etch characteristic
  Strip type automation with unique load-lock vacuum chamber and flat large plasma processing chamber

• 80Plus HS IoN
  with RF 13.56 MHz for physical surface treatment via ion bombardment

Features

The 80Plus and 80Plus HS plasma systems are automated solutions with ingenious load/unload automation to transport the strip type products or wafers in the plasma chamber. The systems are designed to eliminate operator errors and reduce manual work.

80Plus

• Fully automated strip handling
• Advanced host-communication abilities
• Wide range of substrate dimensions
• Prevents operator errors

80Plus HS

• Fully automated strip handling
• Seamless production with parallel leadframe loading / unloading
• The additional vacuum antechamber with magazine reduces the off-peak times
• Unique jam detection
• Broad variation of substrate dimensions possible
• Fewer operator errors and less manual intervention
• Productivity: 200–800 units per hour (UPH)