Plasma Strip Type Systems

• 80 Plus
  2.45 GHz for chemical etch characteristic
  Strip type automation meets flat large plasma chamber

• 80 Plus IoN
  With RF 13.56 MHz for physical surface treatment via ion bombardment

• 80 Plus HS
  2,45GHz for chemical etch characteristic
  Strip type automation with unique loadlock vacuum chamber and flat large plasma processing chamber

• 80 Plus HS IoN
  with RF 13.56 MHz for physical surface treatment via ion bombardement

Features

The 80 PLUS and 80 PLUS HS plasma systems are automated solutions with ingenious load/unload automation to transport the strip type products or wafers in the plasma chamber. This system meets all requirements to eliminate operator errors and save human resources through high efficiency.

80 Plus

• Fully automated strip handling
• Advanced host-communication abilities
• Broad variation of substrate dimensions possible
• Preventing operator mistakes

80 Plus HS

• Fully automated strip handling
• Seamless production with parallel leadframe loading / unloading
• The additional vacuum antechamber with magazine reduces the off-peak times
• Unique jam detection
• Broad variation of substrate dimensions possible
• Prevention of operator errors and reduction of human intervention
• Productivity: 200–800 units per hour (UPH)