IoN Custom series

• Bespoke electrode geometry precisely matched to the substrate size, shape, and material for unmatched uniformity and process control
• True atomic-layer precision or high-rate etching/activation/deposition exactly where you need it — impossible with conventional parallel-plate or off-the-shelf systems
• Integrated advanced capabilities including high-performance PECVD, multi-zone gas delivery, and specialized precursor injection
• Smallest possible cleanroom footprint for the given custom chamber volume and functionality
• Full turn-key solution: process development, qualification, and long-term service backed by PVA TePla’s 50+ years of industrial plasma expertise