Bespoke electrode geometry precisely matched to the substrate size, shape, and material for unmatched uniformity and process control
Atomic-layer precision or high-rate etching, activation, and deposition exactly where you need it, which conventional parallel-plate or off-the-shelf systems cannot achieve
Integrated advanced capabilities including high-performance PECVD, multi-zone gas delivery, and specialized precursor injection
Smallest possible cleanroom footprint for the given custom chamber volume and functionality
Turnkey solution: process development, qualification, and long-term service backed by PVA TePla’s 25+ years of industrial plasma expertise