GIGAbatch 360/380M

• Compact design
• Designed for production applications
• Very low cost of ownership
• Cleanroom-qualified glass front
• Versatile substrate handling (2" to 8")
• High throughput (up to 75 wafers per run)
• Custom wafer support arms included
• Motorized door for wafer loading
• No contact with plasma chamber during loading

Also available on request

• An active control device for the process pressure (DSC)
• A Faraday cage
• Additional gas ducts
• Loading devices for different-sized substrates or wafers
• A ceramic process chamber
• Special seals for operation with process gas containing fluorine