GIGAbatch 360/380P

The plasma systems GIGAbatch 360P and 380P are suitable for the most challenging requirements in the semiconductor industry and use the same chamber geometry. The 360P model, with a chamber diameter of 245 mm, can hold up to 50 wafers with a diameter of 150 mm. In the 380P system, the chamber has an inner diameter of 300 mm and therefore space for 25 wafers with a diameter of 200 mm. The difference from the systems in the M series is the compatibility of the P systems with the requirements of cleanrooms up to class 100.

The GIGAbatch 380P is a fully automated system for loading and unloading complete wafer batches.