Features

Multi-Axis XYZ

  • Multi‑axis motion: X, Y, Z
  • 5 different configurations available
  • Custom scan field with 1 – 200 MHz pulser‑receiver
  • 8‑bit 1 GHz or 12‑bit 250 MHz instrumentation
  • Acrylic or steel inspection tanks; safety light curtains
  • Scanning modes: Pulse‑Echo, Through‑Transmission, A‑Scan, B‑Scan, C‑Scan, TOF, Thickness
  • Time‑ and frequency‑domain measurements including peak amplitude and TOF to interfaces

     

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PVA TePla industrial semiconductor equipment featuring a dual-arm robotic system for precision processing in a cleanroom vacuum technology environment.
PVA TePla NDT CF-300 metrology equipment featuring a blue housing, internal testing chamber, and mechanical components for semiconductor inspection.
A PVA TePla industrial metrology system featuring a large water tank, gantry assembly, and control electronics for precision semiconductor equipment.
PVA TePla metrology equipment featuring a scanning system over a water tank for semiconductor inspection, utilizing precision vacuum technology.
A PVA TePla industrial system for semiconductor equipment, featuring a long blue frame, clear tank, and overhead mechanical gantry for metrology.
Technical Data
Voltage120/240 VAC, 1 phase, 20 Amps
WaterType 2 de-ionized
Dynamic range8-bit 1-GHz | 22-bit 250 MHz
Operating systemWindows 11 Pro

Download datasheet

Voltage120/240 VAC, 1 phase, 20 Amps
WaterType 2 de-ionized
Dynamic range8-bit 1-GHz | 22-bit 250 MHz
Operating systemWindows 11 Pro

Download datasheet

Voltage120/240 VAC, 1 phase, 20 Amps
WaterType 2 de-ionized
Dynamic range8-bit 1-GHz | 22-bit 250 MHz
Operating systemWindows 11 Pro
Air5 PSI

Download datasheet

Voltage120/240 VAC, 1 phase, 20 Amps
WaterType 2 de-ionized
Dynamic range8-bit 1-GHz | 22-bit 250 MHz
Operating SystemWindows 11 Pro
Air5 PSI

Download datasheet

Voltage120/240 VAC, 1 phase, 20 Amps
WaterType 2 de-ionized
Dynamic range8-bit 1-GHz | 22-bit 250 MHz
Operating systemWindows 11 Pro
Air5 PSI

Download datasheet

Applications

The system supports contour‑following inspections of curved or irregular geometries, billet and bar‑stock evaluation, turntable‑based 360° scanning, and multi‑angle or multi‑axis acoustic analysis of industrial components.

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