Features
The SAM Auto Panel meets Class 10 cleanroom requirements and are capable of reliably detecting defects such as gaps, voids, holes, inclusions, delaminated areas, or thickness variations in sintered or soldered interfaces. Simultaneous inspection of multiple layers is also possible with our systems.
Our machines can inspect panels ranging in size from, for example, 300 mm x 300 mm up to 750 mm x 750 mm, making them ideally suited for advanced packaging technologies such as PLP (FO-PLP), where tested chips (Known Good Dies, KGDs) are embedded into large rectangular panels and redistribution layers (RDLs) are built—eliminating the need for conventional laminate substrates.
Interested in SAM Auto Panel?