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Main applications
Primary applications include the detection of voids, inclusions, and delaminations in bond interfaces, as well as identifying layer thickness variations in multilayer structures. Such defects may occur in different layers of the component. In mass production, high throughput is essential. Therefore, proprietary software supports simultaneous inspection of multiple layers. Additionally, multiple transducers, full tray scanning, and optimized tray handling are available.
SAM Auto Tray is a customer-specific solution for inline process diagnostics and process control which can be integrated into any production environment thanks to the following features:
Interested in SAM Auto Tray?