• Automated Vapor Phase Decomposition (VPD) with integrated ICP-MS analysis
• Ultra-trace detection of metallic contamination on wafer surfaces
• Fully automated chemical supply, liquid handling, wafer handling and cleaning cycles
• Suitable for hydrophobic and hydrophilic surfaces, bevels and upper bevels on wafers from 4" to 12

The WSMS product family comprises two systems: WSMS Integra and WSMS Integra HT.

• Fully automated VPD with integrated ICP-MS analysis
• HF or HF/Ozone etching with droplet scanning
• Analysis of wafer surfaces, bevels and upper bevels, including hydrophilic surfaces
• Automated wafer heating, weighing and robot handling with flip option
• Fab Supply compatibility, Active Sample Transport (AST) and SECS/GEM-ready automation

• High-throughput wafer surface measurement with up to 8 wafers per hour
• Dual parallel processing modules with separate clean and dirty wafer lines
• Automated chemical supply from fab bulk bottles and AST connection of multiple sources to one ICP-MS
• Dedicated dosing systems, pressure monitoring and leakage sensors to minimize cross-contamination risks
• Full fab integration via SECS/GEM and OHT; SEMI S2/S8 certified and ISO 6 cleanroom ready