Wafer Surface Measurement System

• All media, from process chemicals to ICP-MS calibration, are supplied fully automatically by the system.
• Fully automated rinsing and cleaning cycles.
• Risks to personnel and products from contamination and operating errors are minimized.
• Reduced personnel costs: The central host computer controls the entire system, enables remote operation or control via SECS/GEM of all components, and provides real-time results.