Features at a glance

Wafer Surface Preparation System

  • Layout for maximum robustness against cross-contamination.
  • Depending on requirements, a highly automated workflow of the entire process chain under cleanroom conditions is possible, utilizing loading stations, handling robots, intermediate storage devices, and media supply systems.
  • Centralized control of the entire system, from job management and recipe definition to the recording of all data.
  • Remote access for control and monitoring purposes is available.
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Wafer Surface Preparation System
Technical data
Wafer sizes4" - 12"
SurfacesHydrophobic/hydrophilic/bevel/upper bevel

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