Precise Process Control and Highest Purity

The crystal diameter and the height of the molten zone can be monitored during the process using a camera. Due to contactless melting – the high ultimate vacuum generated by a turbomolecular pump and the use of ultra-pure argon as the process atmosphere – contamination during the process is effectively prevented.

Growth of Large Crystals

For the growth of large crystals, an argon atmosphere with up to 5 bar overpressure can be generated in the FZ-35. Both the upper spindle and the coil can be positioned automatically. It is also possible to introduce nitrogen into the process chamber in addition to argon. Optional features include a gas doping system for crystal doping, a closed DI cooling water system, a shaper for processing source rods, and a system for adjusting the orientation of the seed crystal.

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View into a float‑zone crystal growth chamber showing the molten silicon zone during processing
Technical Data
Crystal pulling length2,700 mm
Crystal diameterUp to 200 mm (8")
Final vacuum2.5 x 10-5 mbar
Max. overpressure5.0 bar(g)
Material: Silicon 
Height11,550 mm
Width3,800 mm
Depth4,050 mm
Footprint (total)5,000 x 6,000 mm
Weight (total)Approx. 2,500 kg

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