SuperComp
The growing demand for reliable semiconductor products is driving increasing complexity in modern semiconductor manufacturing. Managing a broad portfolio of different technologies requires enhanced computational resources. The SuperComp project therefore explores innovative solutions based on artificial intelligence (AI) and advanced computing methods to improve the design, development, and manufacturing of semiconductors.
The SuperComp collaborative project builds on these efforts by investigating AI-based, neuromorphic, and quantum computing methods for complex semiconductor system solutions. Its key areas of focus include the development of technologies for complex systems, as well as cloud-based digital manufacturing and logistics.
Hyperspectral Vision technology enables the comprehensive, automated monitoring of semiconductor production and significantly reduces the use of control wafers. The Group aims to establish the Dresden site as a global technology center for hyperspectral metrology tools, support its organic growth, and further strengthen its patent portfolio.
About PVA Vision
PVA Vision GmbH emerged from fifteen years of research conducted at the Fraunhofer IWS in Dresden. Founded in 2023 as DIVE imaging systems GmbH, the company was acquired by PVA TePla AG in April 2025 and renamed PVA Vision GmbH in July 2025. As part of the PVA TePla Group, PVA Vision benefits from expanded resources, as well as from the Group’s global sales and customer network.
The Dresden-based company develops, manufactures, and markets system solutions for nondestructive optical inspection. Its portfolio comprises the hardware systems VEpioneer® and VEreveal®, as well as the AI-supported software solution VEsolve®, complemented by pre-sales and after-sales services.
The SuperComp collaborative project is co-finanzed by European Union.