One system replaces many

VEreveal

  • Inline inspection system built for semiconductor fab environments (ISO class 3)
  • Available for macro inspection (macro), micro inspection (micro), or both combined (fusion)
  • Near real-time acquisition and evaluation, designed for continuous production monitoring
  • Full-surface (100%) wafer inspection in a single run
  • Replaces multiple measurement methods: eliminates the need for separate FT-IR, SEM, LIBS, X-ray, or AFM measurements
  • Spatial resolution from 300 µm (macro) down to sub-micron (micro)
  • Supports wafer sizes up to 300 mm
  • Certified to SEMI S2, S8, and S14 standards
  • Versatile customization options
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Scanning InfraRed Depolarization System with monitor
Technical Data
Measurement modeReflectance
Measurement time< 10 s (typical)
Wavelength rangeVNIR: 400-1,000 nm | SWIR: 900 – 1,700 nm
Spectral resolutionVNIR: 1.34 nm | SWIR: 3.5 nm


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